IBM debuts first servers powered by silicon-on-insulator technology

Somers 22 May 00 IBM today announced a new line of AS/400e servers powered by the world's first production microchips made of silicon-on-insulator (SOI) transistors and copper wiring. The addition of SOI alone can increase performance up to 20-30 percent beyond the use of copper by protecting the millions of transistors on a chip with a blanket of insulation, reducing harmful electrical leakage that wastes power. IBM was the first chipmaker to substitute copper for aluminum in chip wiring to boost performance and is now the first to perfect high-volume SOI manufacturing.

"Silicon-on-insulator and copper chip technologies are a powerful one-two punch for AS/400e server performance," said Doug Grose, vice president, IBM Server Development. "Our investments in R&D are paying big dividends for the IBM server business and most importantly, for our customers."

"From innovative new chip designs to highly integrated e-business solutions, the AS/400 server line continues to deliver leading technology for e-business," added Patrice Mitchell, vice president, AS/400 product management.

The new AS/400 servers include a powerful high-end enterprise system, the Model 840, that is 3.6 times faster than the previous generation of AS/400 servers. The new chip technology contributes to substantial performance improvements in the product line. The servers are designed to handle highly complex core B2B applications, including supply chain and customer relationship management, as well as solutions like server-side Java, Domino and business intelligence.

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